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JAPAN FINE CERAMICS
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Alumina Wafers

We are able to manufacture alumina wafers up to a maximum size of φ300mm (φ12 inch).
With a high density and few pores, it is possible to form fine circuit patterns.
We also handle substrates with fine rounded/square holes or slits, as well as polished substrates.

Alumina Wafers

Main Applications

  • Substrates for thin film circuits
  • Sensor component substrates
  • Substrates for semiconductor processing

Features

  • Able to manufacture up to a maximum size of φ300 mm (φ12 inch).
  • The material has a low surface roughness (Ra 0.02μm or less) and few surface pores which makes it possible to form fine circuit patterns.
  • The high bending strength allows a reduced thickness.
  • The small dielectric loss tangent in the high frequency band makes it ideal for use with high-frequency circuits.

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