We can provide patterning to the side face.
For PD sub-mount and LD sub-mount, a side face metallize pattern is needed in order to establish a ground on the bottom face via the side face.
- Applicable substrate thickness: 0.3mm or more
- Film composition: Ti/Pd/Au(3μm or more)
- Minimum pattern width for side face (A): 0.07mm±0.05mm
- Distance between side face patterns (B): 0.08mm or more
- Distance from the substrate end (C): 0.05mm or more(Regarding tolerance, please consult us.)
- Pattern length from the substrate end (D): 0.2mm or more ±0.1mm