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JAPAN FINE CERAMICS
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Through hole & castellation

Through hole: By metalizing the inner wall of the through hole, the electric conduction of the top and bottom sides of the substrate can be achieved.

Castellation: By processing and metalizing a semicircle through hole on the side of the substrate, the electric conduction of the top and bottom sides of the substrate can be achieved.

Through hole & castellation

Details

Through-hole diameter: φ 0.1 to 4±0.05mm

Accuracy of position: ±0.02mm

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