SS501/SS701/SS702 Details
High function composite material in which SiC ceramic particles are uniformly impregnated with Si.
Features
We can change SiC ratio and develop products that can meet your needs.
Excellent thermal properties
Low thermal expansion→Equivalent to Si : 3.0 x10-6/K
High thermal conductivity→Higher than AlN : 175～190 W/m･K
Lightweight ･ High rigidity ･ Large size
Density →Equivalent to or lower than SiC : 2.8～3.0 g/cm3
Rigidity →Equivalent to ceramics : 280～350 GPa
Supports large size →Up to 1m×0.5m
※Our company's SiC Up to 1m×1m
| Material | MMC | SiC | Al2O3 | ALN | |||
|---|---|---|---|---|---|---|---|
| SS501 | SS701 | SS702 | SA701 | ||||
| Density (g/cm3) | 2.8 | 3.0 | 3.0 | 3.0 | 3.1 | 3.9 | 3.3 |
| Young's Modulus (GPa) | 280 | 330 | 350 | 260 | 430 | 370 | 320 |
| Thermal Expansion (x10-6/K) | 3 | 3 | 3 | 7 | 3.1 | 7.7 | 2.4 |
| Thermal Conductivity (W/m・K) | 175 | 190 | 170 | 160 | 140 | 33 | 160 |
※The above property values are not guaranteed values.
Manufacturing method
Applications
It is used for precision machinery and inspection equipment parts requiring heat dissipation with overwhelming thermal conductivity.
- LCD manufacturing equipments
- Semiconductor manufacturing equipments
- Machine tools
- Heat sink parts
- Environment and ECO field
- Various production facilities
MMC is widely adopted in various fields.
Adopted Product Examples
High thermal conductivity palte（For semiconductor manufacturing equipment）
