Si/SiC (Infiltration Method)
ーSS501/SS701/SS702-
Composite materials in which a porous body of SiC is infiltrated with metallic silicon.Manufactured by the pressureless infiltration method.
It has an overwhelming low thermal expansion and high thermal conductivity, and it is a material ideal for heat sink parts.
![シリコン/SiC複合材料(SiC50~75vol% 浸透法)SS501/SS701/SS702の画像](/products/images/9315bsmall.png)
Features
- Lightweight : Equivalent to aluminum!
- High rigidity : The Young's Modulus is 1.6times of SUS!
- Low thermal expansion : Equivalent to silicon!
- High thermal conductivity : Higher than SiC!
Applications
- Heat sinks
- Structual material for LCD manufacturing equipments
- Transport hand parts (LCD,Semiconductor)