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Thin Film Integrated Circuits

We provide integrated manufacturing of a range of products from alumina substrates for micro-wave applications to thin film pattern formation. From the initial prototype to mass production, we deliver high quality products at a low price over a short period of time.

To enable our production system to handle mass production of LD, PD submounts, we have newly acquired Au/Sn binary deposition equipment, and dry etching equipment for Pt pattern formation.

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Main Applications

  • Submounts for photodiodes and laser-diodes, sub-carriers, etc.
  • Circuit substrates for transceivers that operate in the milli/micro-wave band, etc.
    (Amplification circuits, frequency conversion circuits, oscillator circuits, filter circuits, etc.)
  • Small resistor arrays Circuit substrates for measuring instruments.
     Circuit substrates for communication and radar equipment.
  • Sensor head circuit substrates.
     Combiner/distributor parts for submarine optical cables, etc.


  • Circuits are able to be printed on substrates that have through-holes or slits cut out.
  • Air bridges, side patterns, and AuSn solder patterns are able to be utilized.
  • It is possible to use conductors, thin film resistors, thin film capacitors, and thin film inductors together on a single board.
  • Conductors: Ti/Pd/Au, Ti/Pt/Au, Ti/Pd/Cu/Ni/Au.
  • Thin film resistor material: Ta2Nx (Sheet resistance: 20Ω/□ , 50Ω/□ , 100Ω/□ , 130Ω/□)
  • Thin film capacitor material: SiO2
  • Solder material: Au/Sn
  • With our combination of fine patterns on a 99.9% alumina substrate, it is possible to create circuits with low losses and low noise in the high-frequency band.
  • We also handle other materials such as high-dielectric constant substrates, aluminum nitride substrates (AlN substrate), and quartz substrates.
  • As a specialized manufacturer of substrates, we possess comprehensive technology development, quality assurance, and problem solving knowhow.
  • We provide quality products according to specific features and specifications. We perform well under strict time constraints and respond quickly to design changes.

castellation Thin film capacitor Lange coupler Through hole Thin film resistor Thin film inductor Side pattern